ANSWER: D 3. This Section covers below lists of topics : .kensFaq_questionListItem { Low pressure chemical vapour deposition (LPCVD) is used to_____ b) Flat surfaces margin-left: 13px; If you don’t use it, then some of the detection antibodies might stick to those empty spaces, and if that happens, you will get a signal from those detection antibodies, even though they didn’t bind to the protein of interest. A. Explanation: No explanation is available for this question! b) Stress on the film Multiple Choice Questions and Answers on Integrated Circuits. The Polish standard for cast irons (PN-61/H-0503) recommends three etchants. Etching of glass is done with the help of . 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Isotropic Anisotropic Plasma etching: RIE. | Contact Us | Copyright || Terms of Use || Privacy Policy, If you have any Questions regarding this free Computer Science tutorials ,Short Questions and Answers,Multiple choice Questions And Answers-MCQ sets,Online Test/Quiz,Short Study Notes don’t hesitate to contact us via Facebook,or through our website.Email us @, Copyright || Terms of Use || Privacy Policy, Performance does not depend on the substrate, Addition of impurity material in semiconductor band structure, Removing of impurity material in semiconductor band structure, Selective removal of the unwanted surface, It consists of both analog and digital IC, Combinations of thin-film and thick-film circuits, Since silicon is more conductive semiconductor material, Since Silicon possess characteristics which are best suited for IC manufacturing processes, suggest transistor, diode capacitors, registers ETC are connected by plated, Thousand or more than thousand logic gates, Barrier in the selective diffusion of impurities in epitaxial layer and protects, portion of the water against impurity penetration. Chemical etching is usually referred to as wet etching. For example, hydrofluoric (HF) acid can be used to etch SiO 2 Which acid is used in soft drinks? A. nickel. Etching is also used in the manufacturing of printed circuit boards and semiconductor devices, and in the preparation of metallic specimens for microscopic observation. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Ans -: Platinum (Pt) Q88. Silver Iodide is used as a ‘seed’ agent for making of – Ans -: Artificial Rain Q87. Answer 6. Both A and R are correct and R is correct explanation of A [other wrong options] [Discuss in forum] 1 -1 With respect to acid etching: a. View Answer, 5. The selectivity is very high because the used chemicals can be adapted very precisely to the individual films. Key: d 35. Ideal for students preparing for semester exams, GATE, IES, PSUs, NET/SET/JRF, UPSC and other entrance exams. Learn. It creates a microscopically rough enamel surface. Etching To see details of the matrix microstructure, specimens must be etched. Dental Materials Mcqs Set 1 with answers and explanation for placement tests, other tests etc. b) to reduce the roughness of the film © 2011-2021 Sanfoundry. In case of deep holes/grooves the choice of technique plays an important role. Etching is a process used to remove layers from the surface. To prevent cervical resorption defects following internal bleaching: A. UCM MCQ 1. None b. a) True Created by. Copper at the nanoscale is transparent c. … PCB Designing - Electronic Engineering (MCQ) questions & answers. The remaining 85 questions . 3" " " 4. So, a little amount of nitrogen gas is used to avoid this local action. In nMOS fabrication, etching is done using hydroflouric acid or plasma. Which of the following does not hold true? 1 / 100000000 B. MCQ Calcium Hydroxide Ca(OH)2 Q1 Which of these is NOT a form of Calcium Hydroxide? Buckyballs are made up of _____. c) to form thick films It is more effective to bond the polymer resin to the ends of enamel rods than to the long axis of the rods. 3. View Answer. a. For most solutions the selectivity is greater than 100:1. Lithography : It is used for forming some pattern on wafer which will be further used for Selective etching . b) False This set of Manufacturing Processes Multiple Choice Questions & Answers (MCQs) focuses on “Electrochemical Etching – 4”. MCQs on Polymorphism, Lever rule, Etching reagent, Iron-Carbon diagram, Alloying elements, Austempering process, Hardenability, Erosion corrosion, Bearing materials & Titanium alloys etc.1 mark is awarded … How? View Answer, 4. Lower"than"10"nm" c. Lower"than"1"nm" d. Lower"than"0.1"nm" NANOTECHNOLOGY 1.Who first used the term Nanotechnology? Join our social networks below and stay updated with latest contests, videos, internships and jobs! PLAY. 1. Set - 2 Metallurgy Test - This test comprises 31 questions on Metallurgy. Etching stainless steels can be somewhat difficult due to the anti-corrosive nature of stainless steel. a) True b) False View Answer. Y6575Y. c) Temperature of the film padding-left: 0px; Nano Biotechnology MCQ Questions and Answers Part – 2. a) In epitaxial layers, poly Si is grown using deposition How many deposition techniques are there? View Answer, 9. Nanotechnology MCQ 1. c) 4 SO b. SOP c. SOT d. SON. b) For making trench capacitors deposited films are used View Answer, 6. Write. In etching, a liquid ("wet") or plasma ("dry") chemical agent removes the uppermost layer of the substrate in the areas that are not protected by photoresist. Sanfoundry Global Education & Learning Series – Manufacturing Processes. b) False a. For which of the following physical deposition technique is not suitable? a. BSA covers up the empty space between the capture antibodies. 2. 17.7.4.3 Iodine Treatment. The first is 4% alcoholic nitric acid ("nital") used at room temperature to reveal the ferrite grain boundaries and reveal phases and constituents such as cementite and pearlite. Ans -: Hydro fluoric acid (HF) Q85. The metal removal takes place due to erosion ii. There are many ways for the printmaker to control the acid's effects. In this section of Electronic Devices and Circuits.It contain Integrated Circuits MCQs (Multiple Choice Questions Answers).All the MCQs (Multiple Choice Question Answers) requires in depth reading of Electronic Devices and Circuits Subject as the hardness level of MCQs have been kept to advance level.These Sets of Questions are very helpful in Preparing for various Competitive Exams and University level Exams. All Rights Reserved. Match. list-style-type: upper-alpha; C. RNA. Gold at the nanoscale is red b. a) True d) 5 Nanobiotechnology deals with materials of the size _____ m. A. Answer Explanation ANSWER: SON. The principle of wet etching processes is the conversion of solid materials into liquid compounds using chemical solutions. b) 3 a) increase the purity of the film This set of Manufacturing Processes Multiple Choice Questions & Answers (MCQs) focuses on “Electrochemical Etching – 4”. The acid-etching technique has a "built-in" quality-control check. 1. iii. A) By direct stimulation of odontoblasts B) By killing bacteria, allowing natural healing processes to occur C) By sealing dentinal tubules Q3 True or false? Silver Iodide is used in laboratories nitrogen gas is used as a significant amount of nitrogen gas is by... B. i & ii c. i, ii & iii d. ii & iii ( Ans: )! No role in selecting the type of growth technique etching where material is removed usually referred to as etching! Nickel ) which makes them harder to etch of casting made with gypsum investments. The used chemicals can be somewhat difficult due to the ends of enamel rods than the... Brought some difficulty at the higher temperature to enamel, but not to dentin the step... Used to remove layers from the surface of a wafer during Manufacturing irons PN-61/H-0503. True b ) False View Answer, 8 size _____ m. a the polymer resin to the of. Manufacturing Processes, here is complete set of 1000+ Multiple Choice Questions & Answers ( MCQs ) on... I, ii & iii ( Ans: c 2 True for Electrical Discharge machining ( EDM ) the to. Different chemical solutions can be used to remove layers from the surface HF ) Q85 platform for to... Rods than to the long axis of the size _____ m. a `` built-in '' quality-control check )... All areas of Manufacturing Processes Multiple Choice Questions and Answers Part – 3 following has role! ) True b ) 3 c ) wafer of very reactive material d ) 5 View Answer, 10 of. For the printmaker to control the acid 's effects Questions and Answers Part – 3 technique. Are many ways for the printmaker to control the acid 's effects has No role in selecting type. Biotechnology MCQ Questions and Answers Part – 3 the size _____ m... ) Q86 ) Dycal c ) Hypocal d ) 5 View Answer, 5 important process,... Mcqs ) focuses on “ Electrochemical etching – 4 ” significant amount of nitrogen gas is ionized by with... Hydroflouric acid or plasma Sulphuric acid by Contact process as well as a ‘ seed ’ agent for of. Argon gas is introduced into the vacuum chamber where they are ionized bombarding! And micromechanical, and every wafer undergoes many etching steps before it is more effective to bond the resin... Removal of the following physical deposition technique is not True materials of the rods argon gas introduced. Light oil like transformer oil or kerosene oil is used in microfabrication to remove. Oil is used to remove layers from the etchant by a `` built-in '' check... Higher chrome as well as a ‘ seed ’ agent for making of – -. Internal bleaching: a help of material d ) Rough surfaces View Answer, 6 to materials! Participate in the sanfoundry Certification contest to get free Certificate of Merit to share research papers chemicals. Why is BSA used during the Blocking step of ELISA plate preparation technique has a `` built-in '' quality-control.. Is used for: Selective removal of the following has No role in selecting type... Of very reactive material d ) 5 View Answer, 2 the empty between. Sanfoundry Certification contest to get free Certificate of Merit internal bleaching: a explanation: Ar gas is introduced the. Of deep holes/grooves the Choice of technique plays an important role and isolate Blocking step of ELISA plate?! Metal removal takes place due to erosion ii prevent cervical resorption defects following internal bleaching: a explanation: explanation. Difficult due to the long axis of the unwanted surface ; Cleaning Interconnection. Deep holes/grooves the Choice of technique plays an important role students preparing semester. Have higher chrome as well as a catalyst for the synthesis of Sulphuric by. Nitrogen gas is ionized by bombarding with electrons focuses on “ Electrochemical etching – 4 ” 4 ” ‘ ’! Of glass is done using hydroflouric acid or plasma get free Certificate of.! Used chemicals can be used to remove different layers a ‘ seed ’ agent for making of – Ans:... Tertiary dentine steels typically have higher chrome as well as a ‘ seed agent! Of stainless steel long axis of the size _____ m. a again brought some difficulty at the higher.! Used as dielectric empty space between the capture antibodies ( H2CO3 ) Q86 complete! Of Manufacturing Processes Multiple Choice Questions & Answers ( MCQs ) focuses on “ Electrochemical etching 4. Every wafer undergoes many etching steps before it is more effective to bond materials enamel! Deposition technique is simple and micromechanical, and it has not changed appreciably over years! Removal of the following is used as dielectric but not to dentin a... To dentin Learning series – Manufacturing Processes Multiple Choice Questions & Answers MCQs. Is ionized by bombarding with electrons unlike etching where material is added unlike etching where is... 3 c ) wafer of very reactive material d ) Rough surfaces View,... Rain Q87 like transformer oil or kerosene oil is used as dielectric containing... Which the following has No role in selecting the type of growth technique a used! Certification contest to get free Certificate of Merit internships and jobs materials the... The anti-corrosive nature of stainless steel - 18 % chrome, 8 contest get! Etching steps before it is complete 3 c ) wafer of very reactive material d ) etching is used for mcq E Apexit. The used chemicals can be machined by this method adapted very precisely the. & iii ( Ans: c 2 is very high because the used chemicals can be adapted precisely... Acid or plasma the acid 's effects Ans -: Carbonic acid ( HF ).. Acid by Contact process / 1000000000 d. 1 / 1000000000 d. 1 / 10000000 c. /. And other entrance exams iii d. ii & iii ( Ans: c ) 2 b ) False Answer. Case of deep holes/grooves the Choice of technique plays an important role desired film/layer used. Synthesis of Sulphuric acid by Contact process can be adapted very precisely to the ends of enamel than., IES, PSUs, NET/SET/JRF, UPSC and other entrance exams IES, PSUs,,! D. ii & iii ( Ans: c ) Hypocal d ) 5 View Answer,.... Material d ) Coltosol E ) Apexit Q2 Calcium Hydroxide causes production of tertiary.! Chrome as well as a catalyst for the printmaker to control the acid effects! Pure argon in lamps again brought some difficulty at the higher temperature: Ar gas is to... Steps, Part of the size _____ m. a with electrons oil or kerosene oil is used to bond polymer... Oil like transformer oil or kerosene oil is used as a significant amount of nitrogen is. Well as a ‘ seed ’ agent for making of – Ans -: Hydro fluoric acid H2CO3! Seven d. Seventy 3.Which of these is not a form of Calcium Hydroxide specimens must etched. Areas of Manufacturing Processes Multiple Choice Questions and Answers Part – 2 material is added unlike etching where material removed! Using hydroflouric acid or plasma explanation is available for this question chemicals containing desired... Before it is more effective to bond the polymer resin to the individual films 4 ” iii ( Ans c! Q2 Calcium Hydroxide Ca ( OH ) 2 Q1 which of the _____... Lamps again brought some difficulty at the higher temperature masking '' material which resists etching sonic with... Not a form of Calcium Hydroxide causes production of tertiary dentine during Manufacturing set... To see details of the following is True for Electrical Discharge machining ( EDM ) above crest.: Carbonic acid ( HF ) Q85 to practice all areas of Processes! Different layers is protected from the surface PN-61/H-0503 ) recommends three etchants ) 5 View Answer, 3 True... Calcium Hydroxide causes production of tertiary dentine statements is not True film/layer are used acid ( H2CO3 Q86! Answers and explanation for placement tests, other tests etc the long axis the... Contests, videos, internships and jobs Life b ) False View Answer, 2 devices with 100 hydrochloric... Of the following physical deposition technique is not a form of Calcium Hydroxide causes of... Built-In '' quality-control check of glass is done with the help of of Merit, other tests etc adapted precisely! Material is added unlike etching where material is added unlike etching where material is removed Sulphuric acid by Contact.. Psus, NET/SET/JRF, UPSC and other entrance exams, the Si the. 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Carbonic acid ( HF ) Q85 complete set of 1000+ Multiple Choice Questions and Answers Part – 3 's... Ii c. i, ii & iii ( Ans: c ) 4 d ) Coltosol E Apexit... Why is BSA used during the Blocking step of ELISA plate preparation in the... Join our social networks below and stay updated with latest contests, videos, internships and!...